SEMICONDUCTOR PROCESS MATERIALS
Custom graphite trays and wafer carriers with the pocket geometry, material requirements and equipment interfaces your application calls for.
Drawing-led customizationGeometry reviewed for your equipment
Application-focused selectionMaterial and surface requirements first
Clear delivery planningSchedule confirmed with your quotation
01 / APPLICATIONS
A graphite tray is more than a holder. Its fit, surface condition and material specification belong in the same conversation as your thermal process.
In compound-semiconductor growth, a graphite tray can support wafer positioning in the hot zone. SiC-coated graphite carriers are established industry components for MOCVD; coating and reactor compatibility must be qualified for each project.
Specify: gas chemistry, rotation interface, pocket profile and coating requirement.
For sapphire and other compound-semiconductor substrates, graphite tray pocket geometry is part of the process design. Match wafer size, edge clearance and loading method to the deposition recipe; do not assume every tray is interchangeable.
Specify: substrate diameter, edge features and required thermal contact.
Evaluate a custom graphite tray for workpiece support in qualified vacuum or inert-gas thermal equipment. The decision should include load distribution, contamination limits and the full heating and cooling cycle.
Specify: atmosphere, temperature profile, support points and cleanliness.
Use a drawing-led graphite tray inquiry when developing a pocket layout or evaluating a replacement carrier. Define the first-article acceptance criteria before planning a repeat batch.
Specify: equipment interface, sample tests and approved drawing revision.
Application notes describe industry uses, not a blanket compatibility claim. Graphite grade, coating and operating conditions must be qualified for your equipment.
02 / PRODUCT COLLECTION
Actual graphite tray images from our collection. Start with a pocket configuration, then specify the dimensions and interfaces that matter.
BATCH WAFER SUPPORT
A circular graphite tray with multiple recessed seats. Pocket diameter, depth and arrangement are defined by the approved drawing.
Discuss this configurationSIX-POCKET CONFIGURATION
A six-seat graphite tray shown in the supplied collection. Actual substrate size and equipment fit require confirmation.
Discuss this configuration
THE DETAILS THAT DEFINE FIT
Define pocket depth and clearance, the seating surface and the mounting features together. A replacement graphite tray should be reviewed against the complete equipment interface, not just its outside diameter.
Review specification priorities03 / MATERIAL & PERFORMANCE
Fine-grain graphite is used in demanding thermal applications for its thermal transport, shock resistance and machinability. The selected grade determines the actual performance.
Compare conductivity and expansion at your operating temperature. A graphite tray's heating response also depends on thickness, contact geometry and equipment design.
Graphite's machinability supports detailed carrier shapes. Specify the pocket profiles and critical datums that determine wafer positioning.
Define impurity limits and verification documents before procurement. Semiconductor suitability must be demonstrated for the actual graphite grade.
Review the coating requirement separately from the graphite body. The process chemistry and cleaning method belong in that decision.
Photographs do not certify material purity, coating composition, temperature rating or process yield.
04 / TECHNICAL SPECIFICATIONS
There is no verified numerical graphite grade sheet in the supplied material. The table below identifies the exact properties to confirm for a quotation and production drawing.
| Parameter | Specification status | What to confirm |
|---|---|---|
| Product type | Graphite tray / wafer carrier | Round recessed-pocket geometry shown in supplied product photos |
| Pocket configurations | 6-pocket and multi-pocket examples | Illustrated layouts only; final count and arrangement by drawing |
| Graphite grade | To be agreed | Define isotropy, grain size, grade identification and process suitability |
| Outside diameter | Drawing-specific, mm | Specify OD, tolerance, datums and equipment clearance |
| Overall thickness | Drawing-specific, mm | Specify thickness, mounting interfaces and allowable deviation |
| Wafer / pocket diameter | Drawing-specific, mm | Define substrate size, loading clearance and thermal expansion allowance |
| Pocket depth | Drawing-specific, mm | Define depth, bottom profile and substrate support requirements |
| Flatness / parallelism | To be agreed, mm or µm | Specify measurement conditions and inspection datums |
| Dimensional tolerance | Feature-specific, mm or µm | Avoid one blanket tolerance for all features |
| Surface finish | To be agreed, Ra in µm | Define functional surfaces and the measurement method |
| Bulk density | Grade-dependent, g/cm³ | Request the selected grade's certified value |
| Thermal conductivity | Grade-dependent, W/(m·K) | State temperature and material direction for comparison |
| Thermal expansion | Grade-dependent, ×10⁻⁶/K | State temperature interval and orientation |
| Flexural strength | Grade-dependent, MPa | Agree on test method and required material data |
| Electrical resistivity | Grade-dependent, µΩ·m | Relevant when the graphite tray functions as a susceptor |
| Purity / ash content | To be agreed, ppm or % | Define critical elements and analytical documentation |
| Surface treatment | Subject to technical confirmation | Uncoated / coating request; chemistry is not verified by photographs |
| Operating conditions | Recipe-specific, °C / pressure / gas | Maximum temperature is not published or universally guaranteed |
| Inspection and packing | Agreed with each order | Define dimensional report, cleanliness and protective packaging |
| Commercial status | Request quotation | Price range, stock, MOQ and lead time are not publicly confirmed |
05 / CUSTOMIZATION & SUPPLY
Reliable delivery starts with a clear specification. Set the graphite tray drawing, acceptance criteria and requested date before confirming the supply plan.
Send your drawing, wafer size, atmosphere, temperature profile and required quantity.
Review the graphite tray grade, pocket geometry, coating request and inspection requirements.
Agree on price, sample requirements, packing and the delivery schedule in the quotation.
Reference the approved graphite tray revision, material specification and acceptance documents for each batch.
Drawing + process conditions + material requirements + quantity + delivery date.
06 / ABOUT XINKEHUI
Shanghai Xinkehui specializes in the production, processing and sales of semiconductor substrate and crystal materials.
Our materials background includes silicon wafers, silicon carbide, sapphire substrates, CVD diamond, YAG single crystals and ZnSe windows. For this graphite tray collection, the focus is straightforward: understand your application, review your custom requirements and establish a clear supply specification.
The public company profile describes an experienced engineering team and non-standard processing capabilities. Exact graphite tray manufacturing scope and project-specific inspection documents are confirmed during technical review.
shanghai xinkehui new materails co.,ltd
Graphite tray geometry and material requirements are reviewed against your application and approved drawing.
Request a confirmed schedule with your quotation. Lead time depends on technical approval, material selection and order scope.
Discuss specifications and qualification needs with our Shanghai contact by email or WhatsApp.
07 / FREQUENTLY ASKED QUESTIONS
Practical answers on graphite tray selection, coating, compatibility and custom orders.
Ask a technical questionA graphite tray positions substrates or workpieces in a thermal process. Depending on the material grade, geometry and surface treatment, graphite wafer carriers are used in semiconductor processing, epitaxy and controlled-atmosphere heat treatment. Confirm compatibility with your equipment and recipe before ordering.
The terms can overlap, but they are not always interchangeable. A carrier supports the wafer; a susceptor also participates in heat transfer or heating. Specify whether your graphite tray must act as a heated susceptor, a rotating wafer carrier or a passive support.
The supplied photographs do not establish the coating chemistry. We do not identify these photographed graphite trays as SiC coated. If you need a SiC-coated graphite susceptor for MOCVD, include coating composition, coverage, thickness and acceptance requirements in your inquiry; availability must be confirmed.
Send a dimensioned drawing showing wafer diameter, pocket count, pocket depth, edge clearance and any alignment features. Custom graphite tray geometry is reviewed against machining feasibility and the intended loading method before a quotation is finalized.
There is no verified standard wafer-diameter range in the supplied graphite tray material. Tell us your wafer diameter and tolerance, including flats or notches. The outside diameter and pocket layout are confirmed on the approved drawing.
There is no single temperature rating for every graphite tray. Grade, atmosphere, pressure, coating, dwell time and ramp rate all matter. Specify your full recipe so that the material and surface requirements can be reviewed. No universal temperature limit is promised on this page.
Hot graphite is susceptible to oxidation in oxygen-containing environments. Do not assume that a graphite tray intended for vacuum or inert gas is suitable for an air furnace. Include oxygen exposure, process temperature and any oxidizing gases in the compatibility review.
Define total ash or impurity limits, critical elements, units, sampling method and the required certificate. Semiconductor graphite tray suitability depends on the actual grade and analytical evidence, not appearance or a general 'high-purity' description.
Define drawing revision, datums, outside diameter, thickness, pocket diameter and depth, flatness and interface dimensions. Agree on inspection methods and acceptance criteria before production. Request the inspection documentation needed for your qualification process.
Follow your equipment and material supplier's qualified procedure. Use clean handling practices, protect pocket edges, and inspect for chips, deposits and coating damage. Do not introduce unqualified solvents, abrasive cleaning or aggressive thermal cycles into a validated process.
Graphite tray pricing depends on the grade, dimensions, pocket layout, surface treatment, quantity and inspection scope. Price range, stock status and delivery date are quotation-based and are not publicly confirmed. Final scheduling follows technical approval and order confirmation.
Include your sample quantity, acceptance tests and planned production volume in the inquiry. Sample feasibility, minimum order quantity and timing are confirmed individually. Keep the approved drawing and material requirements consistent when moving to repeat orders.
Include the drawing and revision, reactor or furnace interface, substrate size, operating atmosphere, temperature profile, material and coating requirements, quantity and requested delivery date. Send drawings by email to [email protected] after preparing your graphite tray inquiry.
Use process-specific limits rather than a fixed lifetime claim. Inspect for cracks, chipped pockets, distortion, abnormal deposits or coating loss. A graphite tray that no longer meets your dimensional or contamination criteria should be removed from service and assessed.
08 / LET'S DISCUSS YOUR APPLICATION
Send your requirements for a drawing-led quotation. Price range, stock and lead time are confirmed individually.
SHANGHAI OFFICERoom 1805, Building 1, Wanda Mall,
1079 Dianshanhu Avenue,
Qingpu District, Shanghai, China
